澳洲8在线计划

https://www.semicorp.com/wp-content/uploads/2020/02/Nitto-Msa-840-auto-wafer-mounter.mp4 OVERVIEWSemiconductor Equipment Corporation is the distributor for the new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places the wafer and frame. The system automatically feeds the tape, applies it to the frame and wafer, trims the tape and removes the waste. The MSA840-II can be converted to full automatic operation with the…

澳洲8注册

OVERVIEWThe MA2008IIR / MA2008IIP is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.FEATURESCombination of various applications are available: DSC, Coin-stack Non-contact arm, Non-contact table Protection tape peeling / UV irradiation Panel mounting MA2008IIR: for Roll tape MA2008IIP: for Pre-cut tape Easy…

澳洲8娱乐平台

OVERVIEWThe DR8500-III applies protection tape on the wafer patterned surface for the back-grinding process.FEATURES8″/6″/5″ wafer available 4″ wafer handling function (Option) Low tension applying (RF version) Adding Table/ Roller heating function available Easy operation by Touch panel Follow to CE mark Adding SECS/GEM available

澳洲8投注平台

OVERVIEWThe HR8500-III removes protection tape from the wafer patterned surface after back-grinding.FEATURES8″/6″/5″”wafer available – 4″ wafer handling (Option) Table heating function Thin wafer available (TW version) Easy operation by Touch panel Adding SECS/GEM available

澳洲8计划软件

OVERVIEWThe DSA 840-ll applies protection tape on the wafer patterned surface for the back-grinding process.FEATURES8″/6″/5″/4″ wafer available 8″- 4″ wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8

澳洲8开奖历史记录

OVERVIEWThe HSA 840-ll removes protection tape from the wafer patterned surface after the back-grinding process.FEATURES8″/6″”/5″/4″ wafer available 8″- 4″ wafer handling available by 1 table Easy operation by Touch panel Follow to CE mark / SEMI S2/S8″

澳洲8龙虎

OVERVIEWThe UA8400 irradiates UV light to dicing tape on the wafer back side to reduce the adhesion strength which allows for handling after the dicing process.FEATURES8″/6″ frame available UV irradiation time automatically calculation Irradiation area expand (To Frame area) N2 purge Check mark stamp after UV irradiation Easy operation by Touch panel & Recipe function…